AccuPlus™ Hub Blade
E-AccuPlus™ – New Hub Blades offer a customizable solution for discrete wafer dicing with improved efficiency and a lower cost of ownership.
By optimizing key blade elements such as diamond grit size, diamond concentration, and nickel bond hardness, in conjunction with the newly introduced features, K&S AccuPlus™ blades deliver superior cut qality, bond life and cost of ownership improvement to the discrete wafer dicing market segment.
- • Customized Soluiton for thin, small die & backside coated discrete wafers
- • Qaulity, precision and cost of ownership improvement
- • Shortened pre-cut process for lower cost of ownership
- • Two series of special nickel bond hardness
- • Multi-levels of diamond concentration
- • Special hub material and design enables high spindle frequency with less vibration