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AccuPlus™ Hub Blade


E-AccuPlus™ – New Hub Blades offer a customizable solution for discrete wafer dicing with improved efficiency and a lower cost of ownership.

By optimizing key blade elements such as diamond grit size, diamond concentration, and nickel bond hardness, in conjunction with the newly introduced features, K&S AccuPlus™ blades deliver superior cut qality, bond life and cost of ownership improvement to the discrete wafer dicing market segment.




  • • Customized Soluiton for thin, small die & backside coated discrete wafers
  • • Qaulity, precision and cost of ownership improvement
  • • Shortened pre-cut process for lower cost of ownership
  • • Two series of special nickel bond hardness
  • • Multi-levels of diamond concentration
  • • Special hub material and design enables high spindle frequency with less vibration