GAOTEC Sdn Bhd

Malaysia:
+604.644 0428 / +604.644 7249
Singapore:
+65.6491 5675 / +65.9001 1710

AccuPlus™ Hub Blade

 

E-AccuPlus™ – New Hub Blades offer a customizable solution for discrete wafer dicing with improved efficiency and a lower cost of ownership.

By optimizing key blade elements such as diamond grit size, diamond concentration, and nickel bond hardness, in conjunction with the newly introduced features, K&S AccuPlus™ blades deliver superior cut qality, bond life and cost of ownership improvement to the discrete wafer dicing market segment.

 

 

Features:

  • • Customized Soluiton for thin, small die & backside coated discrete wafers
  • • Qaulity, precision and cost of ownership improvement
  • • Shortened pre-cut process for lower cost of ownership
  • • Two series of special nickel bond hardness
  • • Multi-levels of diamond concentration
  • • Special hub material and design enables high spindle frequency with less vibration