GAOTEC Sdn Bhd

Malaysia:
+604.644 0428 / +604.644 7249
Singapore:
+65.6491 5675 / +65.9001 1710

Copper™ Hub Blade

 

Hub Blades for Copper Wafer Dicing

Specially-formulated to resist loading when cutting copper-metallized wafers, the new CU Series hub blades reduce top and back side chipping.

Features:

  • • Available in 0.6 mil to 5.0 mil Thicknesses
  • • Exposures of 15 mil to 60 mil
  • • 2-6 µm to 4-8 µm Diamond Grid
  • • Specially-Formulated "CU" Series Bond Hardness and Grit Concentration
  • • Available in AccuCut or Standard Hub, Both with AccuKerf Feature