Copper™ Hub Blade
Hub Blades for Copper Wafer Dicing
Specially-formulated to resist loading when cutting copper-metallized wafers, the new CU Series hub blades reduce top and back side chipping.
- • Available in 0.6 mil to 5.0 mil Thicknesses
- • Exposures of 15 mil to 60 mil
- • 2-6 µm to 4-8 µm Diamond Grid
- • Specially-Formulated "CU" Series Bond Hardness and Grit Concentration
- • Available in AccuCut or Standard Hub, Both with AccuKerf Feature