E-AccuPlus™ – Enhanced Hub Blades for Narrow Street Discrete Wafer Dicing, to Achieve Lower Cost of Ownership E-AccuPlus Hub Blades series provide a differentiate solution to narrow street discrete wafer dicing for quality, precision and lower cost of ownership by deliver.
- • Enhanced solution for Thin, Small die & backside coated Discrete wafers
- • Solution for long life cutting
- • Ready for narrow saw kerf wafer dicing
- • Ease-of-choose part number system for lean manufacture
- • Shortened pre-cut process for lower cost of ownership
- • New Hub design enables High Spindle Frequency Application