GAOTEC Sdn Bhd

Malaysia:
+604.644 0428 / +604.644 7249
Singapore:
+65.6491 5675 / +65.9001 1710

E-AccuPlus™ Blade

 

E-AccuPlus™ – Enhanced Hub Blades for Narrow Street Discrete Wafer Dicing, to Achieve Lower Cost of Ownership E-AccuPlus Hub Blades series provide a differentiate solution to narrow street discrete wafer dicing for quality, precision and lower cost of ownership by deliver.

Features:

  • • Enhanced solution for Thin, Small die & backside coated Discrete wafers
  • • Solution for long life cutting
  • • Ready for narrow saw kerf wafer dicing
  • • Ease-of-choose part number system for lean manufacture
  • • Shortened pre-cut process for lower cost of ownership
  • • New Hub design enables High Spindle Frequency Application