Hub Blades for Dicing Low-k Type Wafers

Nova™ Hub Blades are an immediate solution to the challenges posed by the dicing of low-k type materials by reducing chipping and delamination.

Features:

• • Improve Low-k Wafer Dicing Yields
• • Immediate Solution Using Current Dicing Practices
• • Wide Process Window (Feed Rate & RPM)
• • Choice of 3 Standard Bond/Grit Matrices
• • Diamond Grit from 2.0-6.0 µm
• • Available in 0.8 mil to 2.0 mil Thicknesses