GAOTEC Sdn Bhd

Malaysia:
+604.644 0428 / +604.644 7249
Singapore:
+65.6491 5675 / +65.9001 1710

Nova™ Hub Blade

 

Hub Blades for Dicing Low-k Type Wafers

Nova™ Hub Blades are an immediate solution to the challenges posed by the dicing of low-k type materials by reducing chipping and delamination.

Features:

  • • Improve Low-k Wafer Dicing Yields
  • • Immediate Solution Using Current Dicing Practices
  • • Wide Process Window (Feed Rate & RPM)
  • • Choice of 3 Standard Bond/Grit Matrices
  • • Diamond Grit from 2.0-6.0 µm
  • • Available in 0.8 mil to 2.0 mil Thicknesses