Nova™ Hub Blade


Hub Blades for Dicing Low-k Type Wafers
Nova™ Hub Blades are an immediate solution to the challenges posed by the dicing of low-k type materials by reducing chipping and delamination.
Features:
- • Improve Low-k Wafer Dicing Yields
- • Immediate Solution Using Current Dicing Practices
- • Wide Process Window (Feed Rate & RPM)
- • Choice of 3 Standard Bond/Grit Matrices
- • Diamond Grit from 2.0-6.0 µm
- • Available in 0.8 mil to 2.0 mil Thicknesses