GAOTEC Sdn Bhd

Malaysia:
+604.644 0428 / +604.644 7249
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+65.6491 5675 / +65.9001 1710

Silicon™ Hub Blade

 

Hub Blades for Silicon Wafer Dicing

K&S offers a full range of dicing blade for silicon wafer. Grit sizes, diamond concentrations, bond hardnesses, and hub configurations are optimized to deliver maximum cut quality, throughput and blade life.

Features:

  • • A Wide Range of Grit Sizes
  • • Variable Bond Hardness
  • • Choose From 3 Different Diamond Concentrations
  • • AccuKerf™ Blades