Hub Blades for Silicon Wafer Dicing

K&S offers a full range of dicing blade for silicon wafer. Grit sizes, diamond concentrations, bond hardnesses, and hub configurations are optimized to deliver maximum cut quality, throughput and blade life.

Features:

• • A Wide Range of Grit Sizes
• • Variable Bond Hardness
• • Choose From 3 Different Diamond Concentrations
• • AccuKerf™ Blades