Silicon™ Hub Blade
Hub Blades for Silicon Wafer Dicing
K&S offers a full range of dicing blade for silicon wafer. Grit sizes, diamond concentrations, bond hardnesses, and hub configurations are optimized to deliver maximum cut quality, throughput and blade life.
- • A Wide Range of Grit Sizes
- • Variable Bond Hardness
- • Choose From 3 Different Diamond Concentrations
- • AccuKerf™ Blades